한글목차

세계의 전자 퓨즈(eFuse) 시장 규모는 2024년 5억 5,700만 달러에서 2030년에는 7억 3,740만 달러로 성장할 것으로 추정되고, 예측 기간 동안 CAGR은 4.9%를 기록할 것으로 예측됩니다.

스마트 그리드 및 전기자동차에서 전자 퓨즈의 사용은 에너지 효율을 개선하고 지속가능한 기술을 개발하려는 전 세계 정부 정책에 의해 촉진되고 있습니다. 전자 퓨즈는 신뢰할 수 있는 회로 보호와 효과적인 전력 관리를 제공하기 때문에 이러한 이니셔티브를 지원하는 데 필수적입니다.

패키지 유형에 따라 전자 퓨즈 시장은 스몰 아웃라인 노리드, 듀얼 플랫 노리드, 쿼드 플랫 노리드, 박형 수축 스몰 아웃라인 패키지, 기타로 나뉩니다. 쿼드 플랫 노리드(QFN) 패키지는 초소형 사이즈에 리드가 숨겨져 있고 방열판을 위한 장소를 제공하기 때문에 집적 회로에서 흔히 볼 수 있으며, QFN 패키지는 크기가 작고 열처리가 효율적이며 혼잡한 응용 분야에 적합하기 때문에 전자 퓨즈 시장에서 가장 많이 선택되고 있습니다. QFN 전자 퓨즈는 자동차, 통신, 소비자 가전 등 소형 설계와 예측 가능한 공급이 필요한 모든 애플리케이션에 적용되며, QFN 전자 퓨즈는 회로를 보호하고, 열을 줄이고, 작은 공간에 적합하며, 전력을 안정적으로 제어할 수 있습니다. 전기자동차 및 웨어러블 제품에서 사용이 증가하고 있습니다. 이러한 패키지는 성능과 제조 비용의 균형이 잘 맞기 때문에 많은 제품이 판매되는 시장에서 유용하게 사용되고 있습니다.

응용 분야별로 전자 퓨즈 시장은 솔리드 스테이트 드라이브, 하드 디스크 드라이브, 서버 및 데이터센터 장비, 자동차 전자 제품, 기타로 분류됩니다. 하드 디스크 드라이브는 예측 기간 동안 전자 퓨즈 시장에서 두 번째로 큰 부문이 될 것으로 예상됩니다. 데이터 스토리지에서 전자 퓨즈는 전기 시스템에 필요한 실시간 제어 및 보호 기능을 제공하며, HDD는 과전류 및 단락을 안전하게 처리하기 위해 전자 퓨즈에 의존하여 기업 및 소비자 사용자 모두의 데이터 안전을 보장합니다. 기업용 소프트웨어에 클라우드 기술을 사용하는 데이터센터가 증가하고 고속 스토리지에 대한 수요가 증가함에 따라 전자 퓨즈는 HDD에 더 많이 장착되고 있습니다. 대용량 스토리지에 HDD를 사용하는 것은 SSD보다 여전히 저렴하기 때문에 금전적 제약이 있는 부서에서 선호하며, 전자 퓨즈의 사용이 증가하고 있습니다. 서버와 같은 중요한 애플리케이션을 지원하는 HDD는 전력 문제로부터 추가적인 방어가 필요하며, 전자 퓨즈는 이를 위해 필수적입니다.

북미는 2024년 세계 전자 퓨즈 시장에서 두 번째로 큰 시장이 되었으며, 전자 퓨즈 기술 채택의 선구자 중 하나입니다. 미국과 캐나다에서 전자 퓨즈는 주로 자동차, 산업 및 통신 분야에서 사용되고 있습니다. 미국은 2050년까지 순배출량 제로를 달성하기 위해 에너지 효율이 높은 시스템으로 전환하고 있으며, 그 결과 전자 퓨즈의 사용이 증가하고 있습니다.

Littelfuse, Inc.(미국), Texas Instruments Incorporated(미국), Alpha and Omega Semiconductor(미국), Semiconductor Components Industries, LLC(미국) 등이 전자 퓨즈 시장의 주요 기업들입니다. 이들 주요 기업의 기업 프로파일, 최근 동향, 주요 시장 전략 등 상세한 경쟁 분석을 수록하고 있습니다.

이 보고서는 세계 전자 퓨즈 시장을 유형별, 패키지 유형별, 용도별, 산업별, 지역별로 정의, 설명 및 예측합니다. 또한, 시장의 상세한 정성적 및 정량적 분석을 제공합니다. 주요 시장 촉진요인, 억제요인, 기회 및 과제를 포괄적으로 검토하고 있습니다. 또한, 시장의 다양한 중요한 측면도 다루고 있습니다. 여기에는 경쟁 상황, 시장 역학, 금액 기준 시장 추정, 전자 퓨즈 시장의 미래 동향에 대한 분석이 포함됩니다.

목차

제1장 소개

제2장 조사 방법

제3장 주요 요약

제4장 주요 인사이트

제5장 시장 개요

• 소개
• 시장 역학
• 고객 비즈니스에 영향을 미치는 동향/혼란
• 밸류체인 분석
• 생태계 매핑
• 사례 연구 분석
• 기술 분석
• 가격 분석
• 무역 분석
• 특허 분석
• 2025-2026년의 주요 회의와 이벤트
• 투자와 자금 조달 시나리오
• 관세와 규제 상황
• 규제기관, 정부기관, 기타 조직
• Porter's Five Forces 분석
• 주요 이해관계자와 구입 기준

제6장 2025년 미국 관세의 영향 - 개요

• 소개
• 주요 관세율
• 국가/지역에 대한 영향
  • 북미
  • 유럽
  • 아시아태평양
  • 중동 및 아프리카
  • 남미
• 최종 이용 산업에 대한 영향

제7장 전자 퓨즈 시장(용도별)

• 소개
• 솔리드 스테이트 드라이브
• 하드 디스크 드라이브
• 서버 및 데이터센터 기기
• 자동차 일렉트로닉스
• 기타

제8장 전자 퓨즈 시장(패키지 유형별)

• 소개
• SON
• DFN
• QFN
• TSSOP
• 기타

제9장 전자 퓨즈 시장(유형별)

• 소개
• 자동 리트라이
• 래치

제10장 전자 퓨즈 시장(업계별)

• 소개
• 자동차·운송
• 항공우주 및 방위
• 가전
• 헬스케어
• IT·통신
• 기타

제11장 전자 퓨즈 시장(지역별)

• 소개
• 북미
  • 미국
  • 캐나다
  • 멕시코
• 아시아태평양
  • 중국
  • 일본
  • 인도
  • 한국
  • 기타
• 유럽
  • 독일
  • 영국
  • 프랑스
  • 이탈리아
  • 기타
• 남미
  • 브라질
  • 기타
• 중동 및 아프리카
  • GCC
  • 기타

제12장 경쟁 구도

• 개요
• 주요 진출 기업 전략/강점, 2020-2024년
• 매출 분석, 2021-2024년
• 시장 점유율 분석, 2024년
• 기업 평가와 재무 지표, 2025년
• 브랜드/제품 비교
• 기업 평가 매트릭스 : 주요 진출 기업, 2024년
• 경쟁 시나리오

제13장 기업 개요

• 주요 진출 기업
  • LITTELFUSE, INC.
  • TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
  • TEXAS INSTRUMENTS INCORPORATED
  • ALPHA AND OMEGA SEMICONDUCTOR
  • ANALOG DEVICES, INC.
  • STMICROELECTRONICS
  • MONOLITHIC POWER SYSTEMS, INC.
  • MICROCHIP TECHNOLOGY INC.
  • QORVO, INC.
  • DIODES INCORPORATED
  • VISHAY INTERTECHNOLOGY, INC.
  • SILERGY CORP.
  • INFINEON TECHNOLOGIES AG
  • SEMTECH

제14장 부록

영문목차

The global eFuse market is estimated to grow from USD 557.0 million in 2024 to USD 737.4 million by 2030; it is expected to record a CAGR of 4.9% during the forecast period. The use of eFuses in smart grids and electric vehicles is being fueled by government policies around the world to improve energy efficiency and advance sustainable technologies. Because they provide dependable circuit protection and effective power management, eFuses will be essential in assisting with these initiatives.

"By package type,quad flat no leads is projected to be the largest segment of the eFuse market during the forecast period. "

Based on package type, the eFuse market has been split into small outline No Lead, Dual Flat No Leads, Quad Flat No Leads, Thin Shrink Small Outline Package and others. Quad Flat No Leads (QFN) packages are often seen in integrated circuits because they have a tiny format, hidden leads and provide a place for heat sinking. QFN packages are the top choice in the eFuse market because they are small, efficient at handling heat and well suited for crowded applications. They play a role in Automotives, telecoms and consumer gadgets, all of which require a small design and predictable supply. QFN eFuses protect circuits, cut back on heat, fit in small areas and offer secure control of power. QFN is increasingly used in both electric vehicles and wearable products since it takes up less space and is thin. These packages give a good balance between performance and the cost of producing them, so they are valuable in markets where many products are sold.

"Based on Application, hard disk drives segment is expected to emerge as the second-largest segment of the eFuse market during the forecast period."

By application, the eFuse market has been segmented into solid state drives, hard disk drives, servers and data center equipment, automotive electronics and other applications. Hard disk drives are projected to be the second-largest segment in the eFuse market during the forecast period. For data storage, eFuses provide the necessary real-time control and protection of the electrical system. HDDs depend on eFuses to safely handle overcurrent and short circuits which keeps data safe and secure for both enterprise and consumer users. As more data centers use cloud technology for enterprise software and the demand for fast storage rises, eFuse is showing up more often in HDDs. Using HDD for high-capacity storage is still less expensive than SSD, so they are favored by sectors with financial constraints and increasingly use eFuse. HDDs supporting critical applications such as servers, need additional defense from power issues and eFuses are essential for this reason.

"North America is expected to be the second-largest market during the forecast period."

North America is expected to be the second-largest market in the global eFuse market in 2024 and is among the pioneers in adopting eFuse technology. In the US and Canada, eFuse is being used mainly in automotive, industry and telecommunication fields. Since its goal is to reach net-zero emissions by 2050, the US is helping shift the region toward energy-efficient systems, resulting in an increase in eFuse use.

In-depth interviews have been conducted with various key industry participants, subject-matter experts, C-level executives of key market players, and industry consultants, among other experts, to obtain and verify critical qualitative and quantitative information, as well as to assess future market prospects. The distribution of primary interviews is as follows:

By Company Type: Tier 1- 65%, Tier 2- 24%, and Tier 3- 11%

By Designation: C-Level- 30%, Managers- 25%, and Others- 45%

By Region: North America- 31%, Europe- 19%, Asia Pacific- 40%, Middle East & Africa- 3% and South America- 8%

Note: The tiers of the companies are defined based on their total revenues as of 2023. Tier 1: > USD 1 billion, Tier 2: From USD 500 million to USD 1 billion, and Tier 3: < USD 500 million

Littelfuse, Inc. (US) , Texas Instruments Incorporated (US) , Alpha and Omega Semiconductor (US) , Semiconductor Components Industries, LLC (US) are some of the key players in the eFuse market. The study includes an in-depth competitive analysis of these key, with their company profiles, recent developments, and key market strategies.

Research Coverage:

The report defines, describes, and forecasts the global eFuse market, by type, packaging type, application, vertical, and region. It also offers a detailed qualitative and quantitative analysis of the market. The report provides a comprehensive review of the major market drivers, restraints, opportunities, and challenges. It also covers various important aspects of the market. These include an analysis of the competitive landscape, market dynamics, market estimates, in terms of value, and future trends in the eFuse market.

Key Benefits of Buying the Report

• Analysis of key drivers, restraints, opportunities, and challenges influences the growth of the eFuse market.

Market Development: In 2023, only 20% of the 25 million automobiles had integrated eFuse technology and used advanced programmable eFuses. The increased use of eFuses by a number of industries, such as telecom and industrial automation, is opening up development prospects for market participants worldwide.

• Product Innovation/Development: The market for eFuses is expanding as cloud-based monitoring, IoT connectivity, and AI-driven diagnostics are combined to improve real-time fault detection and power management. Packaging techniques, such as Quad Flat No Leads, increase compactness and dependability, while sophisticated semiconductor designs increase accuracy in current limiting and thermal protection. Sustainability and smart grids have impacted eFuse technology and will drive future advancements in energy efficiency, cybersecurity, and predictive maintenance.
• Market Diversification: In February 2023, Littelfuse, Inc. acquired Western Automation Research and Development Limited, a prominent developer of technology solutions for electrical fault detection. This acquisition marked a significant expansion for Littelfuse into the realm of industrial technology and circuit protection.
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players like Littelfuse, Inc. (US), TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION (Japan), Semiconductor Components Industries, LLC (US), Texas Instruments Incorporated. (US), and Alpha and Omega Semiconductor. (US) among others in the eFuse market.

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS AND EXCLUSIONS
    • 1.3.2.1 eFuse market: By type
    • 1.3.2.2 eFuse market: By package type
    • 1.3.2.3 eFuse market: By application
    • 1.3.2.4 eFuse market: By vertical
  • 1.3.3 YEARS CONSIDERED
• 1.4 UNIT CONSIDERED
• 1.5 CURRENCY CONSIDERED
• 1.6 LIMITATIONS
• 1.7 STAKEHOLDERS
• 1.8 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
• 2.2 MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.2.1 SECONDARY DATA
    • 2.2.1.1 Key data from secondary sources
    • 2.2.1.2 List of major secondary sources
  • 2.2.2 PRIMARY DATA
    • 2.2.2.1 Primary interviews with experts
    • 2.2.2.2 List of key primary interview participants
    • 2.2.2.3 Key industry insights
    • 2.2.2.4 Breakdown of primaries
• 2.3 SCOPE
• 2.4 MARKET SIZE ESTIMATION
  • 2.4.1 BOTTOM-UP APPROACH
  • 2.4.2 TOP-DOWN APPROACH
  • 2.4.3 DEMAND-SIDE ANALYSIS
    • 2.4.3.1 Regional analysis
    • 2.4.3.2 Country-level analysis
    • 2.4.3.3 Calculations for demand-side analysis
    • 2.4.3.4 Assumptions for demand-side analysis
  • 2.4.4 SUPPLY-SIDE ANALYSIS
    • 2.4.4.1 Calculations for supply-side analysis
    • 2.4.4.2 Assumptions for supply-side analysis
• 2.5 FORECAST ASSUMPTIONS
• 2.6 RISK ANALYSIS
• 2.7 RESEARCH ASSUMPTIONS
• 2.8 RESEARCH LIMITATIONS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN EFUSE MARKET
• 4.2 EFUSE MARKET IN ASIA PACIFIC, BY TYPE AND COUNTRY
• 4.3 EFUSE MARKET, BY TYPE
• 4.4 EFUSE MARKET, BY PACKAGING TYPE
• 4.5 EFUSE MARKET, BY APPLICATION
• 4.6 EFUSE MARKET, BY VERTICAL

5 MARKET OVERVIEW

• 5.1 INTRODUCTION
• 5.2 MARKET DYNAMICS
  • 5.2.1 DRIVERS
    • 5.2.1.1 Growing applications of high voltage architecture in EVs
    • 5.2.1.2 Reduced downtime and maintenance costs
  • 5.2.2 RESTRAINTS
    • 5.2.2.1 Design complexities and biased current during operation of eFuse
  • 5.2.3 OPPORTUNITIES
    • 5.2.3.1 Reduced certification workload
    • 5.2.3.2 Rise in hyperscale data centers
    • 5.2.3.3 Ongoing technological advancements in EVs
  • 5.2.4 CHALLENGES
    • 5.2.4.1 Limited awareness of eFuse technology
• 5.3 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 5.4 VALUE CHAIN ANALYSIS
  • 5.4.1 RAW MATERIAL PROVIDERS
  • 5.4.2 MANUFACTURERS
  • 5.4.3 DISTRIBUTORS/ RESELLERS
  • 5.4.4 END USERS
• 5.5 ECOSYSTEM MAPPING
• 5.6 CASE STUDY ANALYSIS
  • 5.6.1 EFUSE PROVIDE ADVANCED SOLUTION BY REPLACING TRADITIONAL SACRIFICIAL FUSES IN VEHICLE ELECTRICAL SYSTEMS
  • 5.6.2 EFUSE SAFEGUARD HIGH-CAPACITY LI-ION BATTERY PACKS IN EV BATTERY MANAGEMENT SYSTEMS FROM INTERNAL SHORTS AND CURRENTS
  • 5.6.3 EFUSE ENSURES UNINTERRUPTED OPERATION OF DATA CENTERS
• 5.7 TECHNOLOGY ANALYSIS
  • 5.7.1 KEY TECHNOLOGIES
    • 5.7.1.1 Wide-bandgap semiconductors (SIC,GAN)
  • 5.7.2 ADJACENT TECHNOLOGY
    • 5.7.2.1 Smart fusing
• 5.8 PRICING ANALYSIS
  • 5.8.1 AVERAGE SELLING PRICE TREND OF EFUSE, BY TYPE
  • 5.8.2 AVERAGE SELLING PRICE TREND OF EFUSE, BY REGION
• 5.9 TRADE ANALYSIS
  • 5.9.1 IMPORT SCENARIO (HS CODE 8542)
  • 5.9.2 EXPORT SCENARIO (HS CODE 8542)
• 5.10 PATENT ANALYSIS
  • 5.10.1 PATENTS APPLIED AND GRANTED, 2014-2024
  • 5.10.2 LIST OF PATENTS, 2020-2024
• 5.11 KEY CONFERENCES AND EVENTS, 2025-2026
• 5.12 INVESTMENT AND FUNDING SCENARIO
• 5.13 TARIFF AND REGULATORY LANDSCAPE
  • 5.13.1 TARIFFS RELATED TO EFUSE PRODUCTS
• 5.14 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
• 5.15 PORTER'S FIVE FORCES ANALYSIS
  • 5.15.1 THREAT OF SUBSTITUES
  • 5.15.2 BARGAINING POWER OF SUPPLIERS
  • 5.15.3 BARGAINING POWER OF BUYERS
  • 5.15.4 THREAT OF NEW ENTRANTS
  • 5.15.5 INTENSITY OF COMPETITIVE RIVALRY
• 5.16 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 5.16.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 5.16.2 BUYING CRITERIA

6 IMPACT OF 2025 US TARIFF - OVERVIEW

• 6.1 INTRODUCTION
• 6.2 KEY TARIFF RATES
• 6.3 IMPACT ON COUNTRY/REGION
  • 6.3.1 NORTH AMERICA
  • 6.3.2 EUROPE
  • 6.3.3 APAC
  • 6.3.4 MIDDLE EAST & AFRICA
  • 6.3.5 SOUTH AMERICA
• 6.4 IMPACT ON END USE INDUSTRIES

7 EFUSE MARKET, BY APPLICATION

• 7.1 INTRODUCTION
• 7.2 SOLID-STATE DRIVES
  • 7.2.1 SIGNIFICANT CONTRIBUTION TO ENERGY SAVINGS, STABLE OPERATION, AND IMPROVED POWER SUPPLY PERFORMANCE TO DRIVE MARKET
• 7.3 HARD DISK DRIVES
  • 7.3.1 FASTER AND MORE ACCURATE INTERVENTION THAN CONVENTIONAL FUSES TO DRIVE MARKET
• 7.4 SERVERS AND DATA CENTER EQUIPMENT
  • 7.4.1 GROWING COMPLEXITIES OF DATA CENTERS TO ACCELERATE DEMAND
• 7.5 AUTOMOTIVE ELECTRONICS
  • 7.5.1 CONTRIBUTION TO SYSTEM RELIABILITY, ENERGY EFFICIENCY, AND ENHANCED SAFETY TO BOOST DEMAND
• 7.6 OTHER APPLICATIONS

8 EFUSE MARKET, BY PACKAGE TYPE

• 8.1 INTRODUCTION
• 8.2 SMALL OUTLINE NO LEAD
  • 8.2.1 CONVERGENCE OF MINIATURIZATION DEMANDS AND SPACE CONSTRAINTS IN PCBS TO FUEL MARKET GROWTH
• 8.3 DUAL FLAT NO LEADS
  • 8.3.1 RISING APPLICATIONS IN SMARTPHONES, WEARABLES, PORTABLE GAMING DEVICES, AND HEARING AIDS TO BOOST DEMAND
• 8.4 QUAD FLAT NO LEADS
  • 8.4.1 COST-EFFECTIVENESS AND HIGH THERMAL PERFORMANCE TO BOOST MARKET
• 8.5 THIN SHRINK SMALL OUTLINE PACKAGE
  • 8.5.1 REDUCED PARASITIC INDUCTANCE AND SHORTENED SIGNAL PATHS TO SUPPORT MARKET GROWTH
• 8.6 OTHER PACKAGING TYPES

9 EFUSE MARKET, BY TYPE

• 9.1 INTRODUCTION
• 9.2 AUTO RETRY
  • 9.2.1 RISING EMPHASIS ON DEVELOPING NEW AND INNOVATIVE EFUSES WITH ENHANCED FUNCTIONALITY TO DRIVE MARKET
• 9.3 LATCHED
  • 9.3.1 INCREASING DEPLOYMENT IN PACEMAKERS AND VENTILATORS TO BOOST MARKET GROWTH

10 EFUSE MARKET, BY VERTICAL

• 10.1 INTRODUCTION
• 10.2 AUTOMOTIVE & TRANSPORTATION
  • 10.2.1 ABILITY TO PROTECT ELECTRONIC SYSTEMS IN OVERCURRENT CONDITIONS TO DRIVE MARKET
• 10.3 AEROSPACE & DEFENSE
  • 10.3.1 ABILITY TO SHIELD CRITICAL COMPONENTS IN MILITARY COMMUNICATION EQUIPMENT FROM VOLTAGE SPIKES OR SHORT CIRCUITS TO BOOST DEMAND
• 10.4 CONSUMER ELECTRONICS
  • 10.4.1 NEED TO REGULATE OR MAINTAIN CONSTANT ELECTRICAL CURRENT FLOW TO DRIVE DEMAND
• 10.5 HEALTHCARE
  • 10.5.1 ENHANCED PATIENT CARE, DATA SECURITY, AND OPERATIONAL EFFICIENCY TO FUEL MARKET GROWTH
• 10.6 IT & TELECOMMUNICATIONS
  • 10.6.1 INCREASING APPLICATIONS IN DATA SERVERS TO BOOST DEMAND
• 10.7 OTHER VERTICALS

11 EFUSE MARKET, BY REGION

• 11.1 INTRODUCTION
• 11.2 NORTH AMERICA
  • 11.2.1 US
    • 11.2.1.1 Growing investments in semiconductor industry to boost demand
  • 11.2.2 CANADA
    • 11.2.2.1 Commitment to building sustainable data center facilities to drive market
  • 11.2.3 MEXICO
    • 11.2.3.1 Emphasis on specializing chip testing and packaging to drive market
• 11.3 ASIA PACIFIC
  • 11.3.1 CHINA
    • 11.3.1.1 Expanding semiconductor industry to foster market growth
  • 11.3.2 JAPAN
    • 11.3.2.1 Advanced industrial and technological landscape to drive market
  • 11.3.3 INDIA
    • 11.3.3.1 Increasing investment in electric vehicles to contribute to market growth
  • 11.3.4 SOUTH KOREA
    • 11.3.4.1 Surging adoption of cloud platforms to facilitate market growth
  • 11.3.5 REST OF ASIA PACIFIC
• 11.4 EUROPE
  • 11.4.1 GERMANY
    • 11.4.1.1 Need for advanced circuit protection solutions to fuel market growth
  • 11.4.2 UK
    • 11.4.2.1 Rising emphasis on strengthening semiconductor industry to foster market growth
  • 11.4.3 FRANCE
    • 11.4.3.1 Growing focus on vehicle electrification to fuel market growth
  • 11.4.4 ITALY
    • 11.4.4.1 Increasing investments data centers to foster market growth
  • 11.4.5 REST OF EUROPE
• 11.5 SOUTH AMERICA
  • 11.5.1 BRAZIL
    • 11.5.1.1 Increasing adoption of Industry 4.0 to support market growth
  • 11.5.2 REST OF SOUTH AMERICA
• 11.6 MIDDLE EAST & AFRICA
  • 11.6.1 GCC
    • 11.6.1.1 Saudi Arabia
      • 11.6.1.1.1 Growing focus on clean energy usage to boost demand
    • 11.6.1.2 Rest of GCC
  • 11.6.2 REST OF MIDDLE EAST & AFRICA

12 COMPETITIVE LANDSCAPE

• 12.1 OVERVIEW
• 12.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020-2024
• 12.3 REVENUE ANALYSIS, 2021-2024
• 12.4 MARKET SHARE ANALYSIS, 2024
  • 12.4.1 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
  • 12.4.2 LITTELFUSE, INC.
  • 12.4.3 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
  • 12.4.4 TEXAS INSTRUMENTS INCORPORATED
  • 12.4.5 ALPHA AND OMEGA SEMICONDUCTOR
• 12.5 COMPANY VALUATION AND FINANCIAL METRICS, 2025
• 12.6 BRAND/PRODUCT COMPARISON
• 12.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024
  • 12.7.1 STARS
  • 12.7.2 EMERGING LEADERS
  • 12.7.3 PERVASIVE PLAYERS
  • 12.7.4 PARTICIPANTS
  • 12.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024
    • 12.7.5.1 Company footprint
    • 12.7.5.2 Type footprint
    • 12.7.5.3 Package type footprint
    • 12.7.5.4 Application footprint
    • 12.7.5.5 Region footprint
• 12.8 COMPETITIVE SCENARIO
  • 12.8.1 PRODUCT LAUNCHES
  • 12.8.2 DEALS
  • 12.8.3 EXPANSIONS

13 COMPANY PROFILES

• 13.1 KEY PLAYERS
  • 13.1.1 LITTELFUSE, INC.
    • 13.1.1.1 Business overview
    • 13.1.1.2 Products/Solutions/Services offered
    • 13.1.1.3 Recent developments
      • 13.1.1.3.1 Product launches
      • 13.1.1.3.2 Deals
    • 13.1.1.4 MnM view
      • 13.1.1.4.1 Key strategies/Right to win
      • 13.1.1.4.2 Strategic choices
      • 13.1.1.4.3 Weaknesses/Competitive threats
  • 13.1.2 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    • 13.1.2.1 Business overview
    • 13.1.2.2 Products/Solutions/Services offered
    • 13.1.2.3 MnM view
      • 13.1.2.3.1 Key strategies/Right to win
      • 13.1.2.3.2 Strategic choices
      • 13.1.2.3.3 Weaknesses/Competitive threats
  • 13.1.3 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • 13.1.3.1 Business overview
    • 13.1.3.2 Products/Solutions/Services offered
      • 13.1.3.2.1 Product launches
    • 13.1.3.3 MnM view
      • 13.1.3.3.1 Key strategies/Right to win
      • 13.1.3.3.2 Strategic choices
      • 13.1.3.3.3 Weaknesses/Competitive threats
  • 13.1.4 TEXAS INSTRUMENTS INCORPORATED
    • 13.1.4.1 Business overview
    • 13.1.4.2 Products/Solutions/Services offered
    • 13.1.4.3 Recent developments
      • 13.1.4.3.1 Product launches
    • 13.1.4.4 MnM view
      • 13.1.4.4.1 Key strategies/Right to win
      • 13.1.4.4.2 Strategic choices
      • 13.1.4.4.3 Weaknesses/Competitive threats
  • 13.1.5 ALPHA AND OMEGA SEMICONDUCTOR
    • 13.1.5.1 Business overview
    • 13.1.5.2 Products/Solutions/Services offered
    • 13.1.5.3 Recent developments
      • 13.1.5.3.1 Product launches
    • 13.1.5.4 MnM view
      • 13.1.5.4.1 Key strategies/Right to win
      • 13.1.5.4.2 Strategic choices
      • 13.1.5.4.3 Weaknesses/Competitive threats
  • 13.1.6 ANALOG DEVICES, INC.
    • 13.1.6.1 Business overview
    • 13.1.6.2 Products/Solutions/Services offered
    • 13.1.6.3 Recent developments
      • 13.1.6.3.1 Deals
  • 13.1.7 STMICROELECTRONICS
    • 13.1.7.1 Business overview
    • 13.1.7.2 Products/Solutions/Services offered
  • 13.1.8 MONOLITHIC POWER SYSTEMS, INC.
    • 13.1.8.1 Business overview
    • 13.1.8.2 Products/Solutions/Services offered
  • 13.1.9 MICROCHIP TECHNOLOGY INC.
    • 13.1.9.1 Business overview
    • 13.1.9.2 Products/Solutions/Services offered
    • 13.1.9.3 Recent developments
      • 13.1.9.3.1 Others
  • 13.1.10 QORVO, INC.
    • 13.1.10.1 Business overview
    • 13.1.10.2 Products/Solutions/Services offered
  • 13.1.11 DIODES INCORPORATED
    • 13.1.11.1 Business overview
    • 13.1.11.2 Products/Solutions/Services offered
  • 13.1.12 VISHAY INTERTECHNOLOGY, INC.
    • 13.1.12.1 Business overview
    • 13.1.12.2 Products/Solutions/Services offered
    • 13.1.12.3 Recent developments
      • 13.1.12.3.1 Product launches
  • 13.1.13 SILERGY CORP.
    • 13.1.13.1 Business overview
    • 13.1.13.2 Products/Solutions/Services offered
  • 13.1.14 INFINEON TECHNOLOGIES AG
    • 13.1.14.1 Business overview
    • 13.1.14.2 Products/Solutions/Services offered
  • 13.1.15 SEMTECH
    • 13.1.15.1 Business overview
    • 13.1.15.2 Products/Solutions/Services offered

14 APPENDIX

• 14.1 INSIGHTS FROM INDUSTRY EXPERTS
• 14.2 DISCUSSION GUIDE
• 14.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 14.4 CUSTOMIZATION OPTIONS
• 14.5 RELATED REPORTS
• 14.6 AUTHOR DETAILS